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The entire process of manufacturing printed circuit boards follows the actions below for some applications:

(Image: [[http://media2.picsearch.com/is?u_5ClyJ5swyKImrgdMD2tFNAbZWLHXkSGFw7aqdW3dQ&height=227|http://media2.picsearch.com/is?u_5ClyJ5swyKImrgdMD2tFNAbZWLHXkSGFw7aqdW3dQ&height=227]])Fundamental Steps for Production Printed Circuit Boards:

1. Setup - the process of determining materials, procedures, and needs to  generally meet the consumer's requirements for the board design in line with the Gerber file information supplied with the purchase order.

2. Imaging - the process of moving the Gerber file information for the layer onto an etch resist film that is placed regarding the copper layer that is conductive.

3. Etching - the standard procedure for exposing the copper along with other areas unprotected by the etch resist film to a chemical that removes the copper that is unprotected leaving the protected copper pads and traces in destination; newer processes use plasma/laser etching in the place of chemical substances to remove the copper product, allowing finer line definitions.

4. Multilayer Pressing - the entire process of aligning the conductive copper and insulating dielectric levels and pushing them under temperature to activate the adhesive within the dielectric layers to form a solid [[http://Sportsrants.com/?s=board%20material|board material]].
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Nevertheless, both in construction types, the component leads are nevertheless electrically and mechanically fixed to the PCB with molten metal solder.

Depending on the number of panels that require to be put together will decide how the components will be soldered. In case it is for a high production volume, then soldering elements to your Printed Circuit Board is best carried out by machine placement. Machine placement is done with bulk revolution reflow or soldering ovens. Otherwise, if the production amount is for tiny volume prototypes, soldering by hand works just fine in most cases (Ball Grid Arrays are now actually impossible to solder by hand).

Often, through-hole and construction that is surface-mount become performed in a single PCB assembly because some required electronic elements only for sale in through-hole packages, while others are just available in surface-mount packages. Also, it's a justification to make use of both associated with the techniques throughout the exact same set up because through-hole mounting can in fact provide more energy for the electronic components which can be prone to proceed through some physical anxiety. Then it can be more wise to use surface-mount techniques in order to take up less space on your board if you know that your PCB isn't going to go through any physical stress.

Following the components happen completely constructed on the PCB, it will always be better to test to ensure that the board functions correctly also to the performance needed. Here are a few regarding the ways they are tested after they are put together.
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